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Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
| Published by | Publication Date | Number of Pages |
| IPC | 08/01/1995 | 36 |
Description
IPC DD-135 – Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
This standard has been written for deposited organic interlayer dielectric materials under evaluation for MCM-D applications. The standard and test methods have been written without bias towards any particular class of materials.
Product Details
- Published:
- 08/01/1995
- Number of Pages:
- 36
- File Size:
- 1 file , 370 KB
- Product Code(s):
- DD-135(D)1
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
