Original price was: $168.00.$100.80Current price is: $100.80.
Design and Assembly Process Implementation for BGAs
standard by Association Connecting Electronics Industries, 01/01/2013
Description
Implementing ball grid array (BGA) and fine-pitch ball grid array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095C delivers useful and practical information to anyone currently using BGAs or FBGAs. Many issues have become especially important due to the change in the alloys of the ball, the ball shape, and the attachment procedures. The major emphasis of Revision C is to provide information on some of the new mechanical failure issues such as cratering or laminate defects caused after assembly.
In addition to providing guidelines for BGA inspection and repair, IPC-7095C addresses reliability issues and the use of lead-free joint criteria associated with BGAs. There are many photographs of X-ray and endoscope illustrations to identify some of the conditions that the industry is experiencing in the implementation of BGA assembly processes.
Product Details
- Published:
- 01/01/2013
- Number of Pages:
- 176
- File Size:
- 1 file , 11 MB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
