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Qualification & Performance Specification for Organic Multichip Module Mounting and Interconnecting Structures
| Published by | Publication Date | Number of Pages |
| IPC | 02/01/1998 | 25 |
Description
IPC 6015 – Qualification & Performance Specification for Organic Multichip Module Mounting and Interconnecting Structures
This specification establishes the specific requirements for organic mounting structures used to interconnect chip components, which in combination form the completed functional organic single-chip module (SCM-L) or organic multichip module (MCM-L) assembly and the quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6011.
Product Details
- Published:
- 02/01/1998
- Number of Pages:
- 25
- File Size:
- 1 file , 1.2 MB
- Product Code(s):
- 6015(D)1
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
