Description

BS PD IEC/PAS 62878-2-5:2015 defines the data format for active and passive devices embedded insidean organic board whose electrical connections are made by means of a via, electroplating,conductive paste or printing of conductive material. The basic structures, the terminology,reliability tests and a design guide are described in the “Standard of device embeddedsubstrate”, JPCA EB01, fourth edition.

A device embedded substrate contains device(s) in the board and is connected in a 3D way.

Conventional 2D design technology using GERBER format cannot describe all the connectioninformation in a device embedded substrate. We have several proposals to express 3D dataformats but they cannot describe the structures given in EB01. The JPCA Committee forstandardization of device embedded substrates has studied various formats and developed aformat, FUJIKO V-1.0, which can express substrate design data in CAM data used in actualproduction. This Publicly Available Specification (PAS) described the FUJIKO data format.

Figure 1.1 shows the design flow of a device embedded substrate. The design data can bedirectly sent to a board manufacturing system using the FUJIKO format, or can be converted toCAM data and then be used in production. The data contain 3D information of coordinates andshapes of devices used. It is possible to check the status of device embedding in a board, andalso make it a common knowledge in production know-how of a production line.

This PAS describes the expression of 3D data information, the concept of layers, the structure ofboard data, and definitions of information repeatedly used in design.

All current amendments available at time of purchase are included with the purchase of this document.