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Resin Coated Copper Foil for Printed Boards Guideline
| Published by | Publication Date | Number of Pages |
| IPC | 11/01/2007 | 19 |
Description
IPC 4563 – Resin Coated Copper Foil for Printed Boards Guideline
This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.
Product Details
- Published:
- 11/01/2007
- Number of Pages:
- 19
- File Size:
- 1 file , 270 KB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
