IPC 7525A

Description

Now includes support for stencils used with lead free processes.

This document provides guidelines for the design and fabrication of stencils for solder paste and surface-mount adhesive. Stencil design for various surface-mount technology, as well as mixed technology with through-hole or flip chip components is discussed. This includes differences for tin lead and lead free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.

Product Details

Published:

02/01/2007

Number of Pages:

28

File Size:

1 file , 800 KB

Note:

This product is unavailable in Russia, Ukraine, Belarus