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Design Standard for Thick Film Multilayer Hybrid Circuits
| Published by | Publication Date | Number of Pages |
| IPC | 12/01/1989 | 67 |
Description
IPC D-859 – Design Standard for Thick Film Multilayer Hybrid Circuits
This standard covers the requirements and considerations for the design of multilayer hybrid circuits based on industry manufacturing capabilities.
Product Details
- Published:
- 12/01/1989
- Number of Pages:
- 67
- File Size:
- 1 file , 1 MB
- Product Code(s):
- D-859(D)1
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
