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Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
standard by Association Connecting Electronics Industries, 08/01/2007
Description
Updated with extended support for components used for lead free assembly! This standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress. It is used to determine which classification level should be used for initial reliability qualification. These devices can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during solder reflow attachment. Developed by IPC and JEDEC.
Product Details
- Published:
- 08/01/2007
- Number of Pages:
- 13
- File Size:
- 1 file , 200 KB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
