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Mechanical Outline Standard for Flip Chip or Chip Scale Configurations
| Published by | Publication Date | Number of Pages |
| IPC | 02/01/2003 | 20 |
Description
IPC J-STD-027 – Mechanical Outline Standard for Flip Chip or Chip Scale Configurations
THis standard establishes mechanical outline requirements for devices supplied in flip chip or CHip Size Package (CSP) formats. including die surface, die terminals, and interconnection balls/bumps/lands to the next level.
Product Details
- Published:
- 02/01/2003
- Number of Pages:
- 20
- File Size:
- 1 file , 90 KB
- Product Code(s):
- J-027(D)1, J-027(D)1
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
