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Thermal Characteristics of Multilayer Interconnection Boards
| Published by | Publication Date | Number of Pages |
| IPC | 01/01/1974 | 20 |
Description
IPC TR-470 – Thermal Characteristics of Multilayer Interconnection Boards
Product Details
- Published:
- 01/01/1974
- Number of Pages:
- 20
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
