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Time, Temperature and Humidity Stress of Final Board Finish Solderability
| Published by | Publication Date | Number of Pages |
| IPC | 05/01/2006 | 54 |
Description
IPC TR 585 – Time, Temperature and Humidity Stress of Final Board Finish Solderability
This Technical Report details the investigations into identifying stress tests that distinguish between robust and non-robust surface finishes. A robust finish will pass a test for solderability whereas a non-robust finish will fail. The stress tests identified do not necessarily duplicate real world environment (fabrication of the bare printed board through assembly), but they must correlate to solderability performance. The Sequential Electrochemical Reduduction Analysis (SERA) was used extensively to evaluate the solderability performance of the finishes after stress exposure.
Product Details
- Published:
- 05/01/2006
- Number of Pages:
- 54
- File Size:
- 1 file , 3.6 MB
- Note:
- This product is unavailable in Russia, Belarus
