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Design and Assembly Process Implementation for Embedded Circuitry
| Published by | Publication Date | Number of Pages |
| IPC | 10/01/2022 | 124 |
Description
IPC 7092 – Revision A – Design and Assembly Process Implementation for Embedded Circuitry
This document describes the design, materials and assembly challenges associated with implementing embedded circuitry into a printed board. It covers various aspects of embedded circuitry related with the design, selection, processing and testing to achieve a completed multilayered structure that is ready for surface mount and/or through-hole component attachment.
Product Details
- Published:
- 10/01/2022
- ISBN(s):
- 9781638160946
- Number of Pages:
- 124
- File Size:
- 1 file , 8.8 MB
